Lock-in Thermography

Lock-in Thermography: Basics and Use for Evaluating Electronic Devices and Materials, 3rd Edition, is a textbook presenting lock-in thermography as a dynamic form of infrared thermography. It examines experimental methodology alongside practical applications for evaluating electronic components and materials.

The text shows how periodic heat modulation yields up to a 1000-fold signal-to-noise improvement and enhanced lateral resolution compared with steady-state techniques. In addition to electronic systems, chapters address non-destructive testing.

Used in colleges and universities, the volume incorporates investigation case studies to ground thermal analysis concepts in realistic testing scenarios.