Printed Electronics for Smart Packaging

Name: Printed Electronics for Smart Packaging
Price: 120 USD
Availability: InStock
ISBN: 9783527351169

by Wei Wu

1st Edition

Publisher: Wiley-VCH

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Electrical Engineering

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Book Details

Print ISBN	9783527351169
eText ISBN	9783527840045
Publisher	Wiley-VCH
Publishing Year	2025
Edition	1st Edition
Language	English
Pages	320

In Printed Electronics for Smart Packaging, 1st Edition, author Wei Wu presents a detailed technical survey covering the materials, technologies, mechanisms, and applications of printed electronics within modern packaging environments. Published by Wiley-VCH, this reference volume explains how functional printing methods allow electronic capabilities to be integrated directly onto packaging structures.

The text structures its primary technical coverage around two complementary paradigms: active packaging and intelligent packaging. It investigates the underlying chemical and physical building blocks essential for flexible circuitry, giving dedicated attention to conductive inks, printable semiconductors, and specialized substrate materials engineered for electronic performance.

Key functional elements reviewed within the text include printed tracks designed for circuit routing and custom self-heating packaging heaters designed for thermal control. This volume offers academics and intersecting industry professionals a grounded synthesis of deposition methods, physical mechanisms, and structural implementation across smart packaging systems.

Chapter 1: Introduction of Printed Electronics and Smart Packaging
- • 1.1 Introduction
- • 1.2 PE Technologies
- • 1.3 Flexible PE Devices
- • 1.4 PE for Smart Packaging
- • 1.5 Content and Structure of This Book
Chapter 2: Mechanisms and Strategies of Smart Packaging
- • 2.1 Introduction
- • 2.2 Active Packaging
- • 2.3 Intelligent Packaging
- • 2.4 Why You Need to Use PE?
Chapter 3: Printing Methods and Integrated Strategies
- • 3.1 Introduction
- • 3.2 Conductive Mechanism of Printed Electronic Inks
- • 3.3 Manufactural Process of PE Devices
- • 3.4 Postprinting Process
- • 3.5 Techniques and Parameters for PE
Chapter 4: Functional Inks and Substrates for Smart Packaging
- • 4.1 Introduction
- • 4.2 Conductive Inks and Pastes
- • 4.3 Printable Semiconductors and Insulator Inks
- • 4.4 Conventional Substrates for PE Devices and Smart Packaging
Chapter 5: Printed Tracks for Smart Tags and Packaging
- • 5.1 Introduction
- • 5.2 Printed Tracks, Interconnected Circuits, and Printed Antennas
- • 5.3 Printed Flexible Transparent Electrodes
- • 5.4 Printed Stretchable Electrodes and Stretchable Interconnects
- • 5.5 Printed Flexible Heaters for Self-heating Packaging
Chapter 6: Printed Optoelectronic Devices and Energy Suppliers for Smart Packaging
- • 6.1 Introduction
- • 6.2 Printed Optoelectronic Devices
- • 6.3 Printed Energy Devices for Smart Tags and IPES
Chapter 7: Printed Sensors and Indicators
- • 7.1 Introduction
- • 7.2 Printed Force Sensors
- • 7.3 Printed Temperature and Humidity Sensors
- • 7.4 Printed Piezoelectric and Triboelectric Sensors
- • 7.5 Printed Gas Sensors
- • 7.6 Printed Time–Temperature/Gas/Freshness Indicators
Chapter 8: Integrated Printed Electronics Systems
- • 8.1 Introduction
- • 8.2 Printed Multisensor Platform
- • 8.3 Wireless Sensor Platforms
- • 8.4 E-skin
- • 8.5 Self-powered IPES
- • 8.6 IPES Tags for Smart Packaging
Chapter 9: Outlooks and Perspectives
- • 9.1 Introduction
- • 9.2 The Consensus of Smart Packaging
- • 9.3 Printed Electronics Technology's Advantages in Manufacturing Smart Packaging Products
- • 9.4 Application Scenarios-Driven Smart Packaging Implementation